Thermally-assisted magnetic recording head capable of reducing the number of binding wires

ABSTRACT

A slider has a slider substrate, an electromagnetic transducer, a waveguide for receiving light from a surface on the side opposite from a medium-opposing surface and guiding the light to the medium-opposing surface side, and a device electrode electrically connected to the electromagnetic transducer. A light source unit includes a light source supporting substrate, a light source, and a lead extending from the slider side to the side opposite from the slider and having both end parts exposed at a surface of the light source unit. The device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit. An end part on the slider side of the lead of the light source unit is soldered to the device electrode of the slider.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thermally assisted magnetic head which writes signals by a thermally assisted magnetic recording scheme, a head gimbal assembly (HGA) equipped with the thermally assisted magnetic head, and a hard disk drive equipped with the HGA.

2. Related Background Art

As hard disk drives have been increasing their recording density, thin-film magnetic heads have been required to further improve their performances. As the thin-film magnetic heads, those of composite type having a structure in which a magnetism detecting device such as magnetoresistive (MR) device and an electromagnetic transducer such as electromagnetic coil device are laminated have been in wide use, while these devices read/write data signals from/onto magnetic disks which are magnetic recording media.

In general, a magnetic recording medium is a sort of discontinuous body in which magnetic fine particles are assembled, while each magnetic fine particle has a single-domain structure. Here, one recording bit is constituted by a plurality of magnetic fine particles. Therefore, for enhancing the recording density, it is necessary to make the magnetic fine particles smaller, so as to reduce irregularities at boundaries of recording bits. When the magnetic fine particles are made smaller, however, their volume decreases, so that the thermal stability in magnetization may deteriorate, thereby causing a problem.

An index of the thermal stability in magnetization is given by K_(U)V/k_(B)T. Here, K_(U) is the magnetic anisotropy energy, V is the volume of one magnetic fine particle, k_(B) is the Boltzmann constant, and T is the absolute temperature. Making the magnetic fine particles smaller just reduces V, thereby lowering K_(U)V/k_(B)T by itself, which worsens the thermal stability. Though K_(U) may be made greater at the same time as measures against this problem, the increase in K_(U) enhances the coercivity of the recording medium. On the other hand, the writing magnetic field intensity caused by a magnetic head is substantially determined by the saturated magnetic flux density of a soft magnetic material constituting a magnetic pole within the head. Therefore, no writing can be made if the coercivity exceeds a permissible value determined by the limit of writing magnetic field intensity.

Proposed as a method for solving such a problem in thermal stability of magnetization is a so-called thermally assisted magnetic recording scheme which imparts heat to a part of a recording medium by irradiation with light from a light source at the time of applying a writing magnetic field, while using a magnetic material having a large value of K_(U), so as to effect writing with lowered coercivity by a magnetic recording device (see, for example, Japanese Patent Application Laid-Open No. 10-162444, No. 2001-255254, No. 2004-158067, No. 2006-185548, IEEE Trans. Magn. Vol. 41, No. 10 pp. 2817-2821 (2005))

SUMMARY OF THE INVENTION

Meanwhile, FIG. 8 of Patent Document 1 and the like disclose a mode in which a supporting substrate for a laser diode is arranged on the rear face of a slider, while light from the laser diode secured to the supporting substrate is guided toward a recording medium through a waveguide provided in the slider. In such a mode, electric connection is hard to achieve between an electromagnetic transducer or magnetic reading device in the slider and an electrode provided in a suspension.

For example, the slider may be provided with respective electrodes electrically connected to the electromagnetic transducer and magnetic reading device, and these electrodes may be connected to electrodes in the suspension with bonding wires. As the number of bonding wires is greater, however, the wires are more likely to come into contact with other objects during their assembling process and cause failures. Therefore, it will be preferred if the number of bonding wires is reduced.

In view of such a problem, it is an object of the present invention to provide a thermally assisted magnetic head with a favorable yield, an HGA equipped with this thermally assisted magnetic head, and a hard disk drive equipped with this HGA.

In one aspect, the present invention provides a thermally assisted magnetic head comprising a slider having a medium-opposing surface, and a light source unit arranged on a surface of the slider on the side opposite from the medium-opposing surface. The slider has a slider substrate, an electromagnetic transducer, a waveguide for receiving light from the surface opposite from the medium-opposing surface and guiding the light to the medium-opposing surface side, and a device electrode electrically connected to the electromagnetic transducer. The light source unit has a light source supporting substrate secured with respect to the slider substrate, a light source secured with respect to the light source supporting substrate so as to be able to supply the light to the waveguide, and a lead extending from the slider side to the side opposite from the slider and having both end parts exposed at a surface of the light source unit. The device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit, or exposed at a side face of the medium-opposing surface of the slider. An end part on the slider side of the lead of the light source unit is soldered to the device electrode of the slider.

In another aspect, the present invention provides a thermally assisted magnetic head having the same structure as that of the above-mentioned thermally assisted magnetic head except that the slider has a slider substrate, an electromagnetic transducer, an auxiliary device to be applied with a voltage, a waveguide for receiving light from the surface opposite from the medium-opposing surface and guiding the light to the medium-opposing surface side, and a device electrode electrically connected to the auxiliary device.

According to these aspects of the present invention, the device electrode for supplying electricity to the device of the slider can electrically be connected to an electrode in a suspension through the solder and the lead of the light source unit without bonding wires. This can reduce failures caused by the bonding wires.

Preferably, both end parts of the lead of the light source unit are exposed at the same side face of the light source unit, while the device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit.

This makes it easy to solder the electrode of the suspension to the lead of the light source unit, and the lead of the light source unit to the device electrode of the slider.

Preferably, the light source and lead are arranged on the same side face of the light source supporting substrate, an intermediate part of the lead between the end part on the slider side and the end part on the side opposite from the slider is covered with an insulating layer without being exposed at the surface of the light source unit, a light source electrode is provided on the insulating layer, and the light source is arranged on the light source electrode.

This is easy to manufacture, since the light source, lead, and light source electrode are formed on the same side face of the light source supporting substrate. Since the light source electrode overpasses the lead while being electrically insulated therefrom, the width and length of the light source electrode can be made greater while effectively utilizing the area of one side face of the light source supporting substrate. This makes it easy to electrically connect the light source and the light source electrode to each other and form the light source electrode with a part not covered with the light source, and a light emission test for the light source and the like can favorably be performed while using this uncovered part.

The head gimbal assembly in accordance with the present invention comprises the above-mentioned thermally assisted magnetic head and a suspension for supporting the thermally assisted magnetic head.

The hard disk drive in accordance with the present invention comprises the above-mentioned head gimbal assembly and a magnetic recording medium.

The present invention can provide a thermally assisted magnetic head with a favorable yield, an HGA equipped with this thermally assisted magnetic head, and a hard disk drive equipped with this HGA.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the hard disk drive in accordance with a first embodiment;

FIG. 2 is a perspective view of an HGA 17;

FIG. 3 is an enlarged perspective view of a thermally assisted magnetic head 21 shown in FIG. 1 and its vicinity;

FIG. 4 is a plan view of a main part of the magnetic head as seen from the medium-opposing surface side;

FIG. 5 is a sectional view of the thermally assisted magnetic head 21 taken along the line V-V of FIG. 3;

FIG. 6 is a sectional view of the thermally assisted magnetic head 21 taken along the line VI-VI of FIG. 3;

FIG. 7 is a perspective view of a laser diode 40; and

FIG. 8 is a perspective view of the hard disk drive in accordance with the first embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following, modes for carrying out the present invention will be explained in detail with reference to the drawings. In the drawings, the same constituents are referred to with the same numerals or letters. For easier viewing of the drawings, ratios of dimensions within and among the constituents in the drawings are arbitrary.

First Embodiment

Hard Disk Drive

FIG. 1 is a perspective view of the hard disk drive in accordance with an embodiment.

The hard disk drive 1 comprises a plurality of magnetic disks 10 which are magnetic recording media rotating about a rotary shaft of a spindle motor 11, an assembly carriage apparatus 12 for positioning thermally assisted magnetic heads 21 onto tracks, and a read/write control circuit 13 for controlling writing and reading actions by the thermally assisted magnetic heads 21 and regulating a laser diode 40 which is a light source for generating laser light for thermally assisted magnetic recording as will be explained later in detail.

The assembly carriage apparatus 12 is provided with a plurality of driving arms 14. These driving arms 14 can be swung about a pivot bearing shaft 16 by a voice coil motor (VCM) 15, and are laminated in a direction along the pivot bearing shaft 16. A head gimbal assembly (HGA) 17 is attached to a leading end part of each driving arm 14. Each HGA 17 is provided with the thermally assisted magnetic head 21 opposing the front face of its corresponding magnetic disk 10. In the thermally assisted magnetic head 21, the surface opposing the front face of the magnetic disk 10 is the medium-opposing surface (also known as air bearing surface) S. The magnetic disk 10, driving arm 14. HGA 17, and thermally assisted magnetic head 21 may be provided singly as well.

HGA

FIG. 2 is a perspective view of the HGA 17. This drawing shows the HGA 17 with its medium-opposing surface S facing up.

The HGA 17 is constructed by firmly attaching the thermally assisted magnetic head 21 to a leading end part of a suspension 20 and electrically connecting one end of a wiring member 203 to a terminal electrode of the thermally assisted magnetic head 21. The suspension 20 is mainly constituted by a load beam 200, an elastic flexure 201 firmly attached onto and supported by the load beam 200, a tongue 204 formed like a leaf spring at the leading end of the flexure 201, a base plate 202 provided at a base part of the load beam 200, and a wiring member 203 which is formed on the flexure 201 and comprises lead conductors and connecting pads electrically connected to both ends of the lead conductors.

It is clear that the suspension in the HGA 17 is not limited to the structure mentioned above. Though not depicted, an IC chip for driving the head may be mounted somewhere in the suspension 20.

Thermally Assisted Magnetic Head

FIG. 3 is an enlarged perspective view of the thermally assisted magnetic head 21 shown in FIG. 1 and its vicinity. FIG. 4 is a view of a main part of the thermally assisted magnetic head 21 in FIG. 3 as seen from the medium-opposing surface S. FIG. 5 is a sectional view of the thermally assisted magnetic head 21 taken along the line V-V of FIG. 3 FIG. 6 is a sectional view of the thermally assisted magnetic head 21 taken along the line VI-VI of FIG. 3.

The thermally assisted magnetic head 21 has a structure in which a light source unit 23 comprising a light source supporting substrate 230 and a laser diode 40 to become a light source for thermally assisted magnetic recording, and a slider 22 having a slider substrate 220 and a magnetic head part 32 are bonded and secured to each other such that a back face 2201 of a slider substrate 220 and a bonding surface 2300 of the light source supporting substrate 230 are in contact with each other. The back face 2201 of the slider substrate 220 is a surface of the slider 22 on the side opposite from the medium-opposing surface S. The bottom face 2301 of the light source supporting substrate 230 is bonded to the tongue 204 of the flexure 201 by an adhesive 45 such as epoxy resin, for example (see FIGS. 5 and 6).

The slider 22 comprises the slider substrate 220 and a magnetic head part 32 for writing and reading data signals.

The slider substrate 220 exhibits a planar form and has the medium-opposing surface S processed such as to yield an appropriate flying height (not depicted). The slider substrate 220 is formed by AlTiC (Al₂O₃—TiC) or the like which is conductive.

As shown in FIGS. 3 to 5, the magnetic head part 32 is formed on an integration surface 2202 which is a side face substantially perpendicular to the medium-opposing surface S of the slider substrate 220. The magnetic head part 32 comprises an MR device 33 as a magnetism detecting device for detecting magnetic information, an electromagnetic coil device 34 as a perpendicular (or in-plane) magnetic recording device for writing magnetic information by generating a magnetic field, a waveguide 35 as a planar waveguide provided between the MR device (an auxiliary device to be applied with a voltage) 33 and electromagnetic coil device 34, a near-field-light-generating part (also referred to as plasmon probe) 36 for generating near-field light for heating the recording layer part of the magnetic disk, and an insulating layer 38 functioning as a cladding formed on the integration surface 2202 so as to cover the MR device 33, electromagnetic coil device 34, waveguide 35, and near-field-light-generating part 36.

As shown in FIG. 3, the magnetic head part 32 further comprises device electrodes 371, 372, 373, 374, 375, 376 formed so as to be exposed at a surface 32 a of the magnetic head part 32 on the side opposite from the medium-opposing surface S. The device electrodes 371, 372 are electrically connected to respective input terminals of the MR device 33. The device electrodes 373, 374 are electrically connected to input terminals of the electromagnetic coil device 34, more specifically to both ends of the coil, respectively. The device electrodes 375, 376 are used for setting the slider substrate 220 to the ground potential, or for an undepicted heater (an auxiliary device to be applied with a voltage) provided within the slider. For setting the slider substrate 220 to the ground potential, it will be sufficient if the device electrode 375 is electrically connected to the slider substrate 220 through a via hole or the like, though not illustrated.

Here, the light source unit 23 is arranged so as to expose the device electrodes 371 to 376 and waveguide 35 at the surface 32 a of the magnetic head part 32 in the slider 22, i.e., so as not to totally cover the device electrodes 371 to 376.

As shown in FIGS. 4 and 5, the MR device 33, electromagnetic coil device 34, and near-field-light-generating part 36 have respective end faces exposed at the medium-opposing surface S.

As shown in FIG. 5, the MR device 33 includes an MR multilayer body 332, and a lower shield layer 330 and an upper shield layer 334 which are arranged at positions holding the MR multilayer body 332 therebetween. Each of the lower and upper shield layers 330, 334 can be constituted by a magnetic material such as NiFe, CoFeNi, CoFe, FeN, or FeZrN having a thickness of about 0.5 to 3 μm formed by pattern plating such as frame plating or the like, for example. The lower and upper shield layers 330, 334 prevent the MR multilayer body 332 from being affected by external magnetic fields which become noise.

The MR multilayer body 332 includes a magnetoresistive film such as CIP (Current In Plane) GMR (Giant Magneto Resistive) multilayer film, CPP (Current Perpendicular to Plane) GMR multilayer film, or TMR (Tunneling Magneto Resistive) multilayer film, and senses signal magnetic fields from magnetic disks with a very high sensitivity.

When including a TMR multilayer film, for example, the MR multilayer body 332 has a structure in which an antiferromagnetic layer having a thickness of about 5 to 15 nm made of IrMn, PtMn, NiMn, RuRhMn, or the like, a magnetization fixed layer which is constituted by a ferromagnetic material such as CoFe or two layers of CoFe or the like holding a nonmagnetic metal layer such as Ru therebetween, for example, and has a direction of magnetization fixed by the antiferromagnetic layer, a tunnel barrier layer made of a nonmagnetic dielectric material formed by oxidizing a metal film having a thickness of about 0.5 to 1 nm made of Al, AlCu, or the like by oxygen introduced into a vacuum apparatus or naturally, for example, and a free magnetization layer which is constituted by a two-layer film constituted by CoFe or the like having a thickness of about 1 nm and NiFe or the like having a thickness of about 3 to 4 nm which are ferromagnetic materials, for example, and forms tunneling exchange coupling with the magnetization fixed layer through the tunnel barrier layer are successively laminated.

An interdevice shield layer 148 made of a material similar to that of the lower shield layer 330 is formed between the M device 33 and waveguide 35. The interdevice shield layer 148 acts to shield the MR device 33 from magnetic fields generated by the electromagnetic coil device 34, so as to prevent exogenous noise from occurring at the time of reading.

The insulating layer 38 made of alumina or the like is formed between the shield layers 330, 334 on the side of the M multilayer body 332 opposite from the medium-opposing surface S, on the side of the shield layers 330, 334, 148 opposite from the medium-opposing surface S, between the lower shield layer 330 and slider substrate 220, and between the interdevice shield layer 148 and optical waveguide 35.

When the M multilayer body 332 includes a CIP-GMR multilayer film, upper and lower shield gap layers for insulation formed from alumina or the like are provided between the MR multilayer body 332 and the upper and lower shield layers 334, 330, respectively. Though not depicted, an MR lead conductor layer for supplying a sense current to the MR multilayer body 332 and taking out its reproduced output is also provided. When the M multilayer body 332 includes a CPP-GMR multilayer film or TMR multilayer film, on the other hand, the upper and lower shield layers 334, 330 also fanction as upper and lower electrode layers, respectively. In this case, the upper and lower shield gap layers and MR lead conductor layer are unnecessary and omitted.

Formed on both sides in the track width direction of the MR multilayer body 332 is a hard bias layer (not depicted) made of a ferromagnetic material such as CoTa, CoCrPt, or CoPt for applying a longitudinal bias magnetic field for stabilizing magnetic domains.

The electromagnetic coil device 34 is preferably one used for perpendicular magnetic recording and comprises, as shown in FIG. 5, a main magnetic pole layer 340, a gap layer 341 a, a coil insulating layer 341 b, a coil layer 342, and an auxiliary magnetic pole layer 344.

The main magnetic pole layer 340 is a magnetic waveguide by which a magnetic flux induced by the thin-film coil 342 is guided to the recording layer of the magnetic disk (medium) to be written while being converged. Here, the end part of the main magnetic pole layer 340 on the medium-opposing surface S side is preferably made smaller than the other part in terms of the width in the track width direction (the sheet depth direction of FIG. 5) and the thickness in the laminating direction (the horizontal direction of FIG. 5). As a result, a fine, strong writing magnetic field adapted to higher recording density can be generated.

The end part on the medium-opposing surface S side of the auxiliary magnetic pole layer 344 magnetically connected to the main magnetic pole layer 340 forms a trailing shield part having a layer cross section larger than that of the other part of the auxiliary magnetic pole layer 344. The auxiliary magnetic pole layer 344 opposes the end part of the main magnetic pole layer 340 on the medium-opposing surface S side through the gap layer (cladding) 341 a and coil insulating layer 341 b made of an insulating material such as alumina.

The auxiliary magnetic pole layer 344 is constituted by an alloy made of two or three elements among Ni, Fe, and Co, an alloy mainly composed of them and doped with a predetermined element, or the like having a thickness of about 0.5 to 5 μm, for example, formed by frame plating, sputtering, or the like, for example.

The gap layer 341 a, which separates the coil layer 342 and main magnetic pole layer 340 from each other, is constituted by Al₂O₃, DLC, or the like having a thickness of about 0.01 to 0.5 μm, for example, formed by sputtering, CVD, or the like, for example.

The coil layer 342 is constituted by Cu or the like having a thickness of about 0.5 to 3 μm, for example, formed by frame plating or the like, for example. The rear end of the main magnetic pole layer 340 and the part of the auxiliary magnetic pole layer 344 remote from the medium-opposing surface S are joined together, while the coil layer 342 is formed so as to surround this joint.

The coil insulating layer 341 b separates the coil layer 342 and auxiliary magnetic pole layer 344 from each other and is constituted by an electrically insulating material such as thermally cured alumina or resist layer having a thickness of about 0.1 to 5 μm, for example.

As shown in FIG. 4, the leading end of the magnetic pole end part 340 on the medium-opposing surface S side is tapered such as to form an inverted trapezoid in which a side on the leading side, i.e., the slider substrate 220 side, is shorter than a side on the trailing side.

The end face of the magnetic pole end part 340 on the medium-opposing surface side is provided with a bevel angle θ so as not to cause unnecessary writing and the like in adjacent tracks under the influence of skew angles generated when driven by a rotary actuator. The bevel angle θ is about 15°, for example. In practice, the writing magnetic field is mainly generated near the longer side on the trailing side, while the length of the longer side determines the width of a writing track in the case of magnetic dominant recording.

Here, the main magnetic pole layer 340 is preferably constituted by an alloy made of two or three elements among Ni, Fe, and Co, an alloy mainly composed of them and doped with a predetermined element, or the like having a total thickness of about 0.01 to 0.5 μm at the end part on the medium-opposing surface S side and a total thickness of about 0.5 to 3.0 μm except for the end part, for example, formed by frame plating, sputtering, or the like, for example. The track width can be set to about 100 nm, for example.

As shown in FIG. 5, the optical waveguide 35, which is shaped like a rectangular plate in this embodiment, is positioned between the MR device 33 and electromagnetic coil device 34, and extends parallel to the integration surface 2202 from the medium-opposing surface S of the magnetic head part 32 to the surface 32 a of the magnetic head part 32 on the side opposite from the medium-opposing surface S. In the waveguide 35, as shown in FIG. 4, two side faces 351 a, 351 b opposing each other in the track width direction and two side faces 352 a, 352 b parallel to the integration surface 2202 are in contact with the insulating layer 38 having a refractive index smaller than that of the waveguide 35 and functioning as a cladding for the waveguide 35 acting as a core.

Returning to FIG. 5 and letting X, Y, and Z axes be the thickness, width, and longitudinal directions of the waveguide 35, respectively, the light emitted along the Z axis from the light-emitting surface of the laser diode 40 is incident on a light entrance surface 354. The waveguide 35 can guide the light incident on the light entrance surface 354 to a light exit surface 353, which is the end face on the medium-opposing surface S side, while reflecting the light by its side faces. The width W35 in the track width direction and thickness T35 of the waveguide 35 shown in FIG. 4 can be set to 1 to 200 μm and 2 to 10 μm, respectively, for example, while the height H35 shown in FIG. 5 can be set to 10 to 300 μm, for example.

The waveguide 35 is constituted by a dielectric material, formed by sputtering, for example, thoroughly having a refractive index n higher than that of the material forming the insulating layer 38. When the insulating layer 38 as a cladding is formed by SiO₂ (n=1.5), for example, the waveguide 35 may be formed by Al₂O₃ (n=1.63). When the insulating layer 38 is formed by Al₂O₃ (n=1.63), the waveguide 35 may be formed by Ta₂O₅ (n=2.16), Nb₂O₅ (n=2.33), TiO (n=2.3 to 2.55), or TiO₂ (n=2.3 to 2.55). When the waveguide 35 is constituted by such a material, the propagation loss of laser light is reduced not only by favorable optical characteristics inherent in the material but also by the fact that the total reflection condition is attained at the interface, whereby the efficiency by which the near-field light occurs improves.

As shown in FIGS. 4 and 5, the near-field-light-generating part 36 is a planar member arranged at the light exit surface 353 of the waveguide 35. As shown in FIG. 5, the near-field-light-generating part 36 is buried in the light exit surface 353 of the waveguide 35 so as to expose an end face at the medium-opposing surface S. As shown in FIG. 4, the near-field-light-generating part 36 exhibits a triangular form as seen from the medium-opposing surface S side and is formed by a conductive material. Examples of the conductive material include metals such as Au and alloys.

A base 36 d of the triangle is arranged parallel to the integration surface 2202 of the slider substrate 220, i.e., parallel to the track width direction, while a pointed end part 36 c opposing the base 36 d is arranged closer to the main magnetic pole layer 340 than is the base 36 d. Specifically, the pointed end part 36 c is arranged so as to oppose the leading edge of the main magnetic pole layer 340. A preferable form of the near-field-light-generating part 36 is an isosceles triangle in which two base angles at both ends of the base 36 d are equal.

The height H36 of the triangle of the near-field-light-generating part 36 is sufficiently smaller than the wavelength of the incident laser light, preferably 20 to 400 nm. The width W36 of the base 36 d is sufficiently smaller than the wavelength of the incident laser light, preferably 20 to 400 nm. The angle at the vertex yielding the pointed end 36 c is 60 degrees, for example.

The thickness of the near-field-light-generating part 36 is preferably 10 to 100 nm. Such waveguide 35, near-field-light-generating part 36, and the like can easily be formed by photolithography techniques such as liftoff.

When the near-field-light-generating part 36 is irradiated with the light from the laser diode 40, near-field light is mainly generated by the pointed end part 36 c. This seems to be because, when the near-field-light-generating part 36 is irradiated with light, electrons in the metal constituting the near-field-light-generating part 36 are subjected to plasma oscillations, so that electric fields are converged at its leading end part.

Though depending on the wavelength of incident laser light and the form of the waveguide 35, the near-field light generated by the near-field-light-generating part 36 has the highest intensity at the boundary of the near-field-light-generating part 36 as seen from the medium-opposing surface S in general. In this embodiment in particular, the electric field vector of light reaching the near-field-light-generating part 36 lies in the laminating direction (X direction) of the laser diode 40. Therefore, the strongest radiation of near-field light occurs in the vicinity of the leading end 36 c. Namely, in a thermally assisted action in which the recording layer part of the magnetic disk is heated by light, the part opposing the vicinity of the leading end 36 c becomes a major heating action part.

The electric field intensity of the near-field light is incomparably stronger than that of incident light, while this very strong near-field light rapidly heats an opposing local part of the magnetic disk surface. Consequently, the coercivity of this local part decreases to such a level as to enable writing by the writing magnetic field. Therefore, writing by the electromagnetic coil device 34 is allowed even when using a magnetic disk having a high coercivity for high-density recording. The near-field light reaches a depth of about 10 to 30 nm from the medium-opposing surface S toward the surface of the magnetic disk. Hence, at the current flying height of 10 nm or less, the near-field light can sufficiently reach the recording layer part. Thus generated near-field light has a width in the track width direction or medium moving direction on a par with the depth reached thereby, while its electric field intensity exponentially decays as it travels farther, and therefore can heat the recording layer part of the magnetic disk very locally. In the case of optical dominant recording, the diameter of near-field light determines the writing track width.

The form of the near-field-light-generating part 36 can be modified in various ways without being restricted to the one mentioned above.

Light Source Unit

Constituents of the light source unit 23 in the thermally assisted magnetic head 21 will now be explained with reference to FIGS. 3 to 6.

The light source unit 23 mainly comprises the light source supporting substrate 230, the laser diode (light source) 40 having a planar outer form, leads 471, 472, 473, 474, 475, 476, and light source electrodes 47, 48.

The light source supporting substrate 230 is a substrate made of AlTiC (Al₂O₃—TiC) or the like and has the bonding surface 2300 bonded to the back face 2201 of the slider substrate 220 as shown in FIG. 5. A heat insulating layer 230 a made of alumina or the like is formed on the bonding surface 2300. An insulating layer 41 formed from an insulating material is provided on a device forming surface 2302 which is one side face when the bonding surface 2300 is taken as the bottom face. As shown in FIG. 3, the light source electrodes 47, 48 are formed on the insulating layer 41, while the laser diode 40 is secured onto the light source electrode 47. The leads 471 to 476 are provided in the insulating layer 41.

The material for the insulating layer 41 is not restricted in particular, but preferably an electrically insulating material having a high thermal conductivity, examples of which include AlN, diamond-like carbon, and SiC. Though not restricted in particular, the thickness of the insulating layer 41 is preferably 0.1 to 100 μm, for example.

As shown in FIG. 3, the leads 471 to 476 are buried within the insulating layer 41. The leads 471 to 476 extend in a direction perpendicular to the medium-opposing surface S, i.e., in the thickness direction of the light source unit 23. On the slider 22 side, the leads 471 to 476 have respective end parts 471 a to 476 a exposed at a surface 411 of the insulating layer 41 forming a side face of the light source unit 23. On the side opposite from the slider 22, the leads 471 to 476 have respective end parts 471 b to 476 b exposed at the surface 411 of the insulating layer 41. On the other hand, intermediate parts 471 c to 476 c which are positioned between the end parts 471 a to 476 a on the slider 22 side and the end parts 471 b to 476 b on the side opposite from the slider 22 are covered with the insulating layer 41 and not exposed at the surface 411.

Such leads can be manufactured by photolithography, plating, or the like with a metal such as Au or Cu, for example.

As shown in FIGS. 3 and 6, the device electrodes 371 to 376 of the slider 22 are electrically connected to the end parts 471 a to 476 a on the slider 22 side of the leads 471 to 476 in the light source unit 23, respectively, through reflowed solder pieces 250.

As shown in FIG. 3, a pair of leads constituting the wiring member 203 are electrically connected to the electrodes 273, 274 of the suspension 20, while the electrodes 273, 274 are electrically connected to the end parts 473 b, 474 b of the leads 473, 474 on the side remote from the slider 22 through reflowed solder pieces 252, respectively, whereby a voltage can be applied to both ends of the electromagnetic coil device 34 (see FIG. 4 and the like). When a voltage is applied between a pair of device electrodes 371, the electromagnetic coil device 34 as an electromagnetic transducer is energized, whereby a writing magnetic field occurs.

Another pair of leads constituting the wiring member 203 are electrically connected to the electrodes 271, 272 of the suspension 20, while the electrodes 271, 272 are electrically connected to the end parts 471 b, 472 b of the leads 471, 472 on the side remote from the slider 22 through reflowed solder pieces 252, respectively, whereby a voltage can be applied to both ends of the M device 33 (see FIG. 4). When a voltage is applied between a pair of electrodes 271, 272, a sense current flows through the MR device 33. Information written in the recording medium can be read by causing the sense current to flow through the MR device 33.

Still another pair of leads constituting the wiring member 203 are electrically connected to the electrodes 275, 276 of the suspension 20, while the electrodes 275, 276 are electrically connected to the end parts 475 b, 476 b of the leads 475, 476 on the side remote from the slider 22 through reflowed solder pieces 252, respectively, whereby a voltage can be applied to a heater or the like in the insulating layer if any, for example. Also, the potential of one of them can be used to ground the slider substrate 220 of the slider 22.

As shown in FIG. 3, the light source electrode 47 is formed at the center part of the surface 411 of the insulating layer 41 so as to extend in the track width direction. Here, the light source electrode 47 is arranged so as to pass above the intermediate parts 473 c, 474 c, 476 c of the leads 473, 474, 476, while interposing the insulating layer 41 therebetween, and overpasses them. On the other hand, the light source electrode 48 is formed at a position separated in the track width direction from the light source electrode 47. The light source electrode 48 is arranged so as to pass above the intermediate parts 471 c, 472 c, 475 c of the leads 471, 472, 475, while interposing the insulating layer 41 therebetween, and overpasses them. The light source electrodes 47, 48 further extend toward the flexure 201 for connection with the flexure 201 by solder reflow.

As shown in FIG. 5, the light source electrode 47 is electrically connected to the light source supporting substrate 230 through a via hole 47 a provided within the insulating layer 41. The light source electrode 47 also functions as a heat sink for transferring heat occurring at the time of driving the laser diode 40 toward the light source supporting substrate 230 through the via hole 47 a. Since the light source electrode 47 is electrically connected to the light source supporting substrate 230, the potential of the light source supporting substrate 230 can be adjusted to the ground potential, for example, through an electrode 247.

Each of the light source electrodes 47, 48 can be constructed by a layer of Au, Cu, or the like having a thickness of about 1 to 3 μm formed by vacuum vapor deposition, sputtering, or the like, for example, on a foundation layer having a thickness of about 10 nm made of Ta, Ti, or the like, for example.

The laser diode 40 is electrically connected onto the light source electrode 47 through a solder layer 42 (see FIG. 5) made of a conductive solder material such as Au—Sn. Here, the laser diode 40 is arranged with respect to the light source electrode 47 so as to cover only a part thereof.

As shown in FIG. 3, one of leads constituting the wiring member 203 is electrically connected to the electrode 247, while the electrode 247 is connected to the light source electrode 47 of the light source unit 23 through a reflow solder piece 252. Another lead is electrically connected to an electrode 248, while the electrode 248 is connected to the light source electrode 48 of the light source unit 23 through a reflow solder piece 252. Therefore, the laser diode 40 emits light when a driving current is supplied between the electrodes 247, 248.

For forming the reflow solder pieces 250, 252, a method known as solder bonding may be used. Specifically, molten solder balls are bonded to a pair of electrodes by ultrasonic waves or the like and then heated by a laser or the like, so as to reflow, thereby bonding the electrodes to each other with the reflow solder piece 250. Examples of solder materials include Au, Sn, Pb and their alloys, though not restricted in particular.

FIG. 7 is a perspective view of the laser diode 40.

The laser diode 40 may have the same structure as one typically used for optical disk storage. For example, the laser diode 40 has a structure in which an n-electrode 40 a, an n-GaAs substrate 40 b, an n-InGaAlP cladding layer 40 c, a first InGaAlP guide layer 40 d, an active layer 40 e made of a multiple quantum well (InGaP/InGaAlP) or the like, a second InGaAlP guide layer 40 f, a p-InGaAlP cladding layer 40 g, an *n-GaAs current blocking layer 40 h, a p-GaAs contact layer 40 i, and a p-electrode 40 j are successively laminated. Reflective films 50, 51 made of SiO₂, Al₂O₃, or the like for pumping oscillations by total reflection are formed in front and rear of a cleavage surface of the multilayer structure. A light exit end 400 from which the laser light is emitted is provided with an opening at a position corresponding to the active layer 40 e in one reflective film 50. When a voltage is applied to thus constructed laser diode 40 in the thickness direction, the laser light is emitted from the light exit end 400.

As regards the wavelength λ_(L) of laser light to be emitted, a laser diode adapted to emit laser light having the appropriate wavelength λ_(L) is selected in view of the form and metal material of the near-field-light-generating part 36 and the refractive index n of the material constituting the waveguide 35 as mentioned above.

As mentioned above, the laser diode 40 has a width (W40) of about 200 to 350 μm, a length (or depth L40) of 250 to 600 μm, and a thickness (T40) of about 60 to 200 μm, for example. Here, the width W40 of the laser diode 40 can be reduced to about 100 μm, for example, while its lower limit is the distance between the opposing ends of the current blocking layer 40 h. However, the length of the laser diode 40 is related to the current density and cannot be made so small. In any case, it will be preferred if the laser diode 40 secures a considerable size taking account of handling at the time of mounting.

For driving the laser diode 40, a power supply in the hard disk drive can be used. In practice, the hard disk drive is typically equipped with a power supply of about 2 V, for example, whose voltage is high enough for laser oscillations. The power consumption of the laser diode 40 is about several tens of mW and thus can sufficiently be covered by the power supply in the hard disk drive.

The n-electrode 40 a of the laser diode 40 is secured to the light source electrode 47 by the solder layer 42 (see FIG. 4) made of AuSn or the like. Here, the laser diode 40 is secured to the light source supporting substrate 230 such that the light exit end (light exit surface) 400 of the laser diode 40 faces down (in the −Z direction) in FIG. 4, i.e., the light exit end 400 is parallel to the bonding surface 2300, whereby the light exit end 400 can oppose the light entrance surface 354 of the waveguide 35 in the slider 22. For securing the laser diode 40 in practice, for example, a vapor deposition film of an AuSn alloy having a thickness of about 0.7 to 1 μm is formed on the surface of the light source electrode 47, and the laser diode 40 is mounted thereon and then secured thereto by heating to about 200 to 300° C. with a hot plate or the like under a hot air blower.

The p-electrode 40 j of the laser diode 40 is electrically connected to the light source electrode 48 by a bonding wire. Without bonding wires, the laser diode 40 may be provided with a step, so as to reduce the distance between the light source electrode 48 and the p-electrode 40 j of the laser diode 40, and they may be electrically connected to each other with solder of AuSn or the like. The light source electrode 47 may be connected to the p-electrode 40 j instead of the n-electrode 40 a. In this case, the n-electrode 40 a is connected to the light source electrode 48 by a bonding wire or the like.

When soldering with the above-mentioned AuSn alloy, the light source unit is heated to a high temperature around 300° C., for example. The light source unit 23 is manufactured separately from the slider 22 in this embodiment, whereby the magnetic head part within the slider is not adversely affected by the high temperature. Also, since the magnetic head part 32 and the light source unit 23 are separated from each other, the magnetic head and the state of mounting the light diode in the light source unit can be inspected separately from each other, whereby the total yield can be improved by combining nondefective products together.

The back face 2201 of the slider 22 and the bonding surface 2300 of the light source unit 23 are bonded to each other by an adhesive layer 44 (see FIG. 5) such as UV-curable adhesive, for example, while the light exit end 400 of the laser diode 40 is arranged so as to oppose the light entrance surface 354 of the waveguide 35.

The structures of the laser diode 40 and light source electrodes are not limited to those in the above-mentioned embodiment as a matter of course. For example, the laser diode 40 may have a different structure using other semiconductor materials such as those based on GaAlAs. Other brazing materials can be used for soldering the laser diode 40 to electrodes. The laser diode 40 may be formed by epitaxially growing a semiconductor material directly on a unit substrate.

The slider 22 and light source unit 23 may have any sizes. For example, the slider 22 may be a so-called femto slider having a width in the track width direction of 700 μm, a length (depth) of 850 μm, and a thickness of 230 μm. The light source unit 23 may have substantially the same width and length as those of the slider in this case. In practice, a conventionally employed laser diode typically has a width of about 250 μm, a length (depth) of about 350 μm, and a thickness of about 65 μm, for example. The laser diode 40 having such a size can fully be mounted on a side face of the light source supporting substrate 230 having such a size, for example. The bottom face of the light source supporting substrate 230 may be provided with a groove, within which the laser diode 40 can be placed.

For example, a spot of a far-field pattern of laser light having reached the light entrance surface 354 of the waveguide 35 may have a diameter in the track width direction of about 0.5 to 1.0 μm, for example, and a diameter orthogonal thereto of about 1 to 5 μm, for example. Preferably, in conformity thereto, the waveguide 35 receiving the laser light has a thickness T35 of about 2 to 10 μm, for example, which is greater than the spot, and a width (W35) in the track width direction of about 1 to 200 μm, for example.

Operations

Operations of the thermally assisted magnetic head 21 in accordance with this embodiment will now be explained.

At the time of a writing or recording action, the thin-film magnetic head 21 hydrodynamically floats by a predetermined flying height above the surface of the rotating magnetic disk (medium) 10. Here, the ends of the MR device 33 and electromagnetic coil device 34 on the medium-opposing surface S side oppose the magnetic disk 10 with a minute spacing therefrom, so as to effect reading and writing by sensing and applying a data signal magnetic field, respectively.

When writing a data signal, the laser light propagated from the light source unit 23 through the optical waveguide 35 reaches the near-field-light-generating part 36, whereby near-field light is generated by the near-field-light-generating part 36. This raises the temperature in a predetermined recording area of the magnetic recording medium opposing the medium-opposing surface, thereby temporarily lowering the coercivity of the recording area. Therefore, when the electromagnetic coil device 34 is energized during this coercivity decreasing period, so as to generate a writing magnetic field, information can be written in the recording area.

When writing is performed on the magnetic disk having a high coercivity by the thin-film magnetic head for perpendicular magnetic recording while employing the thermally assisted magnetic recording scheme, a recording density of 1 Tbits/inch² class, for example, can be achieved by extremely finely dividing recording bits.

The laser light propagating in a direction parallel to the layer surface of the waveguide 35 can be made incident on the light entrance surface (end face) 354 of the waveguide 35 in the slider 22 by using the light source unit 23 in this embodiment. Namely, laser light having an appropriate size and direction can reliably be supplied in the thermally assisted magnetic head 21 constructed such that the integration surface 2202 and the medium-opposing surface S are perpendicular to each other. This makes it possible to realize thermally assisted magnetic recording with a high heating efficiency in the recording layer of the magnetic disk.

In this embodiment, the device electrodes 371 to 376 provided in the slider 22 so as to supply voltages to devices such as the electromagnetic coil device 34 and MR device 33 in the slider 22 are exposed at the surface 32 a of the slider 22 on the side opposite from the medium-opposing surface S without being covered with the light source unit 23, so as to be electrically connected to the electrodes of the suspension 20 through the reflow solder pieces 250 and the leads 471 to 476 exposed at the side face 411 of the light source unit without bonding wires. This can reduce failures caused by the bonding wires.

Also, the end parts 471 b to 476 b of the leads 471 to 476 on the side opposite from the slider 22 are exposed at the surface 411 of the insulating layer 41. This makes it easier to connect the suspension 20 to the leads 471 to 476.

Further, the intermediate parts 471 c to 476 c of the leads 471 to 476 are covered with the insulating layer 41, and the light source electrodes 47, 48 are arranged so as to cover the intermediate parts 471 c to 476 c while interposing the insulating layer 41 therebetween. Since the laser diode 40, leads 471 to 476, and light source electrodes 47, 48 are formed on the same side face 2302 of the light source supporting substrate 230, they are easy to manufacture. Since the light source electrodes 47, 48 overpass the leads 471 to 476 while being electrically insulated therefrom, the width and length of the light source electrodes 47, 48 can be made greater while effectively utilizing the area of one side face 2302 of the light source supporting substrate 230. This makes it easy to electrically connect the laser diode 40 and the light source electrode 47 to each other and form the light source electrode 47 with a part not covered with the laser diode 40, and a light emission test for the laser diode 40 source and the like can favorably be performed by bringing a voltage applying probe or the like into contact with this uncovered part and the light source electrode 48 having a large area.

Second Embodiment

The second embodiment of the present invention will now be explained with reference to FIG. 8. The second embodiment is the same as the first embodiment except for the outermost device electrodes 371, 374 in the track width direction of the slider 22, which will solely be explained.

In this embodiment, the device electrodes 371, 374 are also exposed at surfaces 38 b, 38 c in the track width direction of the slider 22, i.e., side faces of the medium-opposing surface S, respectively. In the end parts 471 a, 474 a on the slider side of the leads 471, 474, the surfaces opposing the slider are also exposed, while the slider-opposing surfaces of the end parts 471 a, 474 a of the leads 471, 474 are electrically connected to side faces of the device electrodes 371, 374 by reflow solder pieces 250, respectively. This embodiment can also reduce bonding wires.

The present invention can be modified in various ways without being restricted to the above-mentioned embodiments

For example, the light source is not limited to the laser diode, but can be embodied by other light-emitting devices such as LED.

Though the leads 471 to 476 are connected to the electrodes in the suspension 20 with the reflow solder pieces 252 on the side face 411 of the light source unit 23 in the above-mentioned embodiments, they may be electrically connected to the suspension 20 by reflow solder or the like on the surfaces of the leads 471 to 476 on the side opposite from the slider 22, i.e., the surfaces opposing the slider 22.

When the side face 411 of the light source unit 23 has a sufficiently large track width and the like, the light source electrodes 47, 48 are not required to overpass the intermediate parts 471 c to 476 c of the leads 471 to 476. In this case, the leads 471 to 476 may be arranged on both end sides in the track width direction, while the light source electrodes 47, 48 may be provided at the center part in the track width direction. Here, the intermediate parts 471 c to 476 c may also be exposed at the surface.

Though all the devices such as the electromagnetic coil device 34 and MR device 33 are connected to the electrodes in the suspension 20 through the device electrodes 371 to 376, reflow solder pieces 250, and leads 471 to 476 without wire bonding in the above-mentioned embodiments, the present invention can be embodied if only one of the devices employs the connecting method mentioned above.

The electromagnetic coil device 34 may be one for longitudinal magnetic recording. In this case, lower and upper magnetic pole layers are provided instead of the main magnetic pole layer 340 and auxiliary magnetic pole layer 344, and a writing gap layer is held between the end parts on the medium-opposing surface S side of the lower and upper magnetic pole layers. Writing is effected by a leakage magnetic field from the position of the writing gap layer.

The near-field-generating part may employ a so-called “bowtie” structure in which a pair of triangular or trapezoidal plates are arranged such that their vertexes or shorter sides oppose each other while being separated by a predetermined distance therebetween. The near-field-generating part may have a minute opening instead of the plate. The laser light may be allowed to directly impinge on the recording medium without providing the near-field-generating part.

Though provided by one layer in FIG. 4 and the like, the coil layer 342 may be constituted by two or more layers or a helical coil.

The heat insulating layer 230 a may be formed on the back face 2201 of the slider substrate 220 or totally omitted.

For bonding the light source unit 23 and slider 22 to each other, adhesives other than the UV-curable adhesive, e.g., the solder layer made of AuSn or the like used for bonding the laser diode 40 and light source electrode 47 to each other, may also be employed.

Though employed as a linear waveguide in the above-mentioned embodiment, the waveguide 35 may be a parabolic waveguide whose outer form within the YZ plane exhibits a parabola with the near-field-generating part arranged at its focal position, or have an elliptical outer form or the like within the YZ plane or a taper form in which the leading end closer to the medium is tapered. The hard disk drive equipped with the above-mentioned thermally assisted magnetic head and HGA can fully prevent writing errors from occurring because of insufficiently heating the recording medium during writing actions, while fully keeping side erasure from occurring.

All the foregoing embodiments show the present invention illustratively but not restrictively, whereby the present invention can be carried out in various other modified and altered modes. Therefore, the scope of the present invention is defined only by the claims and their equivalents. 

1. A thermally assisted magnetic head comprising a slider having a medium-opposing surface, and a light source unit arranged on a surface of the slider on the side opposite from the medium-opposing surface; wherein the slider has a slider substrate, an electromagnetic transducer, a waveguide for receiving light from the surface opposite from the medium-opposing surface and guiding the light to the medium-opposing surface side, and a device electrode electrically connected to the electromagnetic transducer; wherein the light source unit has a light source supporting substrate secured with respect to the slider substrate, a light source secured with respect to the light source supporting substrate so as to be able to supply the light to the waveguide, and a lead extending from a slider-opposing side of the light source unit to a side opposite from the slider-opposing side and having both end parts exposed at a surface of the light source unit; wherein the device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit, or exposed at a side face of the medium-opposing surface of the slider; and wherein an end part of the lead on the slider-opposing side of the light source unit is soldered to the device electrode of the slider.
 2. A thermally assisted magnetic head according to claim 1, wherein both end parts of the lead of the light source unit are exposed at a side face of a slider-opposing surface of the light source unit, while the device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit.
 3. A thermally assisted magnetic head according to claim 2, wherein the light source and lead are arranged on a side face of a slider-opposing surface of the light source supporting substrate; wherein an intermediate part of the lead between the end part on the slider side and the end part on the side opposite from the slider is covered with an insulating layer without being exposed at the surface of the light source unit; wherein a light source electrode is provided on the insulating layer; and wherein the light source is arranged on the light source electrode.
 4. A head gimbal assembly comprising: the thermally assisted magnetic head according to claim 1; and a suspension for supporting the thermally assisted magnetic head.
 5. A hard disk drive comprising: the head gimbal assembly according to claim 4; and a magnetic recording medium.
 6. A thermally assisted magnetic head comprising a slider having a medium-opposing surface, and a light source unit arranged on a surface of the slider on the side opposite from the medium-opposing surface; wherein the slider has a slider substrate, an electromagnetic transducer, an auxiliary device to be applied with a voltage, a waveguide for receiving light from the surface opposite from the medium-opposing surface and guiding the light to the medium-opposing surface side, and a device electrode electrically connected to the auxiliary device; wherein the light source unit has a light source supporting substrate secured with respect to the slider substrate, a light source secured with respect to the light source supporting substrate so as to be able to supply the light to the waveguide, and a lead extending from a slider-opposing side of the light source unit to a side opposite from the slider-opposing side and having both end parts exposed at a surface of the light source unit; wherein the device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit, or exposed at a side face of the medium-opposing surface of the slider; and wherein an end part of the lead on the slider-opposing side of the light source unit is soldered to the device electrode of the slider.
 7. A thermally assisted magnetic head according to claim 6, wherein both end parts of the lead of the light source unit are exposed at a side face of a slider-opposing surface of the light source unit, while the device electrode of the slider is exposed at the surface of the slider on the side opposite from the medium-opposing surface without being covered with the light source unit.
 8. A thermally assisted magnetic head according to claim 7, wherein the light source and lead are arranged on a side face of a slider-opposing surface of the light source supporting substrate; wherein an intermediate part of the lead between the end part on the slider side and the end part on the side opposite from the slider is covered with an insulating layer without being exposed at the surface of the light source unit; wherein a light source electrode is provided on the insulating layer; and wherein the light source is arranged on the light source electrode.
 9. A head gimbal assembly comprising: the thermally assisted magnetic head according to claim 6; and a suspension for supporting the thermally assisted magnetic head.
 10. A hard disk drive comprising: the head gimbal assembly according to claim 9; and a magnetic recording medium. 